Phoseon’s semiconductor inspection systems use infrared light to see through silicon

Phoseon’s MX series inspection systems are based on Phoseon’s Semiconductor Light Matrix (SLM) technology that provides highly efficient infrared output in a narrow spectral band that is optimized for applications such as through-silicon wafer bond imaging and inspection, MEMs seal inspection, as well as SOI and flip chip die bond inspection.

The key to the imaging quality and resolution of Phoseon’s MX series products is a combination of hardware and software developments known as Si-Thru™.  Phoseon has combined optics, sensors and lighting systems with a powerful set of image enhancement software tools to provide applications in semiconductor testing and manufacturing with the ability to image internal features as well as surface features.

The MX 100 system has motorized stages with the ability to store die locations to enable the operator to perform manual inspections and manually classify defects.  The MX 100 can also be used to create a full wafer map.

The MX 1000 and MX 2000 have fully automated optical inspection (AOI) capability, making it a platform for production applications in the inspection of MEMs, sensors, bonded wafers and bare wafers where surface and sub-surface features need to be imaged.  The system uses an infrared area backlighting solution and is designed to be a highly capable and user friendly inspection tool for volume production environments.  MX systems can also be easily upgraded from a bench top system to a fully enclosed system with fully automated wafer handling.

	Applications that benefit from Phoseon’s MX products range from MEMS devices inspection to bare wafer inspection to bonded wafer inspection. Learn more about Phoseon MX applications.